What is the main function of a PCB
Time of issue:
2025-05-26
The pins of resistors, capacitors, chips and other components are connected through pads and lines to form a complete circuit loop, avoiding the complexity and reliability of traditional "point-to-point" manual wiring.
Electrical connection carriers
The pins of resistors, capacitors, chips and other components are connected through pads and lines to form a complete circuit loop, avoiding the complexity and reliability of traditional "point-to-point" manual wiring.
Physical support and protection
It provides mechanical support for the fixed installation of components, and at the same time protects the circuit from environmental factors such as external forces, moisture, and dust through the substrate material.
Signal transmission and performance optimization
The multilayer board separates the power plane, ground plane, and signal plane, reducing electromagnetic interference (EMI) and improving the transmission quality of high-frequency signals (e.g., RF, high-speed digital signals).
Special substrate materials, such as Rogers high-frequency boards, can be used in 5G communications, radar, and other scenarios where signal loss is sensitive.
Manufacturing process of PCB (using rigid double-sided board as an example)
Substrate Preparation: Cut the FR-4 substrate to the specified size and clean the surface.
Inner line production:
A photosensitive dry film is applied to transfer the line pattern to the copper foil through exposure and development.
Etching removes excess copper foil, retains the circuit pattern, and forms an inner conductive layer.
Lamination: The inner layer, prepreg (PP sheet, used to bond between layers) and the outer layer of copper foil are laminated and pressed into a complete substrate by high temperature and pressure.
Drilling and copper immersion: drill through holes, conduct the hole wall through electroless copper immersion, and connect the inner and outer lines.
Outer circuit fabrication: Similar to the inner layer process, the outer circuit and pad are formed.
Surface treatment: Coating the pad surface with a protective layer (e.g., tin spraying, immersion gold) to prevent oxidation and improve solderability.
Solder Mask & Silk Screen:
Solder mask ink (usually green, but can also be red, blue, etc.) is applied to expose only the pads, protecting the line and preventing short circuits.
Silk screen printing characters (e.g., component designation, polarity identification) for easy assembly and maintenance.
Forming & Inspection: Milling or stamping out of the board shape, checking for line continuity and defects by means of AOI (Automated Optical Inspection), flying probe testing, and more.
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